Surface mount technology of chip components.
نویسندگان
چکیده
منابع مشابه
Mounting of Surface Mount Components
Over the past few year, electronic products, and especially those which fall within the category of Consumer Electronics, have been significantly reduced in physical size and weight. Products such as cellular telephones, lap-top computers, pagers, camcorders, etc., have been reduced by as much as 3/4 of their original introductory size and weight. The most significant contributing factor to thi...
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Most education tracts in Industrial Technology prepare students with traditional content relevant to industry. Learning these skills is critical to a student’s ability to function in any industrial field and these skills have always dominated industrial education. Within recent years, however, new computer technology is rapidly changing the face of industry. This comes in many forms, one of whi...
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What automated soldering methods can be considered for Mini-Circuits surface-mount components? There are two basic methods: reflow and wave soldering. Generally, reflow soldering can be done when (l) there are only surface mount components, or (2) these are present together with through-hole components and the latter will be soldered in a separate (wave soldering) step. The surface-mount compon...
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Solder paste masks or stenc.ils are an integral part of the manufacturing process for surface mount circuit boards. This study will examine the feasibility of developing a process for rapidly ' Currently at IUA-Tencor Corporation, San Jose, CA 0-7803-6482-1 /OO/$lO.OO 02000 IEEE 2000 IEEWCPMT Int'l Electronics Manufactluring Technology Symposium
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A novel and direct method to measure the stress-strain properties of surface mount solder joints is proposed in this paper. The specimen used in the experiments is a quad flat pack (QFP)-solder-printed circuit board (PCB) assembly and the fabrication of solder joints makes use of conventional surface mount technology (SMT). Mechanical cycling and thermal shock testing can be conducted directly ...
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ژورنال
عنوان ژورنال: Circuit Technology
سال: 1988
ISSN: 1884-118X,0914-8299
DOI: 10.5104/jiep1986.3.188